Thermal Analysis Systems: Tina Barcley

PROFESSIONAL SUMMARY

Exceptional dynamic individual who is recognized to interactively lead multiple disciplines at all levels and engage team members as well as team leads. Proactive problem-solver who can see the big picture, break it down into executable portions, eliminate barriers, and close on-time and on-budget. Demonstrated track record of running several programs and proposals simultaneously - the largest was $200M. Employs a direct approach to creating, innovating, and streamlining designs. Recipient of multiple patents in electronics packaging and materials development. Provided management in several different industries for production volumes from 1 piece to 4 million.

PROFESSIONAL EXPERIENCE

TAS CONSULTING, Thermal Analysis Systems, Mendon, NY (2008-present)

CTO

Harsh Environment Electronics Reliability for Government Primes and Commercial Electronics

Sole source to Government Primes to provide Electronics Packaging Reliability Expertise. Created proposals and quotations, performed harsh environmental analysis, solder fatigue analysis, test plan creation and execution, design consulting, procedure writing, organizational training, and all levels of testing.

ITT, Space Systems Division, Rochester, NY (2001-2010)

Sr. Program Manager

New Business Manager of Space Control and Missile Defense from 2006 to 2010

Executed proposals, won business study into a new area, and executed program within schedule and budget. Study resulted in winning active proposal due to the innovation and cost reduction seen in the payload. Customer needed a "Purple Cow" and it was provided. Customer wanted a no-frills approach for quick tactical missions. We gave them an interchangeable payload with a reconfigurable software choice of 4 mission sensors in a small satellite format.

Program Manager of New Generation Satellite Study from 2005 to 2009
  • • Successfully doubled a government study contract in 2006 focusing on the next generation of satellites. Executed the program with stellar performance warranting outstanding customer feedback, especially in responsiveness and scheduling. Prioritized tasks for high level technical experts to maximize quality and quantity of work needed to support the program deliverables. Provided crisp summaries and recommendations for management strategic verification in the areas of optical system architecture and sensor enhancements.
  • • Managed multiple sections for several large proposals - responsible for technical and cost detailing. Provided technical input for all sections of proposals as well as costing and risk assessments. Supported on-going proposals in the areas of System Architecture including software, EMI / EMC, Packaging, PM&P, Reliability, Manufacturability, Accessibility, Testability, Thermal, Vibration, and Supplier Subcontracts. Recently submitted 2 patents on optical architecture and mirror design.
Manager of Electronics Packaging from 2001 to 2006
  • • Created Electronics Packaging Group (105 engineers, technicians, and supervisors), hired staff, and clearly articulated direction.
  • • Recognized technical expert in Packaging and Design for Manufacturing - educated personnel company wide on electronics packaging and grounding, prohibited materials, cables, and Engelmaier analyses. Recognized technical expert in Specialty Engineering, especially in Materials and Parts selection, usage, and requirement compliance. Submitted 12 patents in the area of Electronics Thermal Management and Heat Removal.
  • • Interacted directly with customers as ITT spokesperson for workmanship, materials, thermal, RF Grounding, electronics packaging and quality issues. Provided new Prohibited Materials Testing 10% under predicted budget and on time for 3 commercial satellite programs (including subcontracted power supply). Accelerated testing schedule two-fold to meet new schedule.

DAIMLER CHRYSLER, Rochester Hills, MI (1995-2001)

R&D Lab Manager and Packaging Producibility Expert

Provided strategic road map for technologies to be developed for production input. Devised and provided rigor for exit criteria required for successful implementation of road map. Responsible for large portion of the $10M budget for Materials and Component Development lab for Chrysler Advanced Packaging for Underhood Electronics. Developed Auto Industries' first underhood BGA. Submitted 9 patents in the areas of RF Packaging, Thermal Packaging, and Electronics Processing and Material Development.

  • • Developed new flexible board and thermally conductive film / adhesive usage for production.
  • • Developed first underhood BGA for 1999 automobiles that was extended into more types of modules in 2002 and then again in 2004.
  • • Developed production metrics that could be gated as the life of the product continued and was expanded.
  • • Qualified new potting for production use - exit criteria and usage was so phenomenal to solder fatigue improvements that invited to speak at SAE convention for International Suppliers.
  • • Created advanced packaging concepts with knowledge of solder fatigue and creep.

OTHER RELEVANT WORK

SVERDRUP TECHNOLOGY (MSFC Contractor), Huntsville, AL

Product Team Manager of NASA AFE Satellite

Developed environmental pollutants tracking database for propulsion emissions. Project Manager responsible for NASA AFE Satellite. Tiger Team Lead across 4 locations (US and Canada) for system maintenance and reliability concerns. Designed facility pressurized line addition testing hydrazine expulsion concepts.

TRW, Redondo Beach, CA and AEROJET, Sacramento, CA

Senior Engineer and Team Lead of Aerospace Structure and Thermal Analyses

Spacecraft payload modeling with ANSYS and PATRAN for 2D / 3D structural and thermal analysis. Showed the benefits of new platelet hip-bonding process and specialized materials for new nose cone design.

SINGER LIBRASCOPE, Glendale, CA

Team Lead for High Reliability Army | Navy | Avionics

EDUCATION

MS, Industrial Systems Engineering, University of Alabama at Huntsville, 1996

Focus on Project / Engineering Management and Quality Systems (lean engineering and statistics)

BS, Engineering, focus Electronics Packaging and Materials, Harvey Mudd College, Claremont, CA

AWARDS & CERTIFICATES

Completed Toastmasters Competent Communication and Leadership Programs, 2010

Completed Program Managers Training, 2007

Authored 2 training modules for ITT's Program Management Program, 2010

Lean-Six-Sigma Greenbelt Certification, 2007

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