Tina has worked many industries in her 30 year career, developing 21 US Patents — all in Electronics Packaging, Materials, and Thermal.
Tina has worked in electronic packaging, testing, and analysis for aerospace companies (ITT, TRW, Perkin Elmer, Goodrich and Aerojet), NASA (Marshall Space Flight Center), automotive (both Ford and Chrysler), military black boxes (Singer Librascope, Army, Navy and Air Force modules) as well as high end commercial and testing components (Spectracom, MKS, Kodak, etc.). She has run and created testing labs, procedures, designs, fixes for designs — developing 21 US patents — all in electronics packaging, materials, and thermal. She is a frequent speaker at industry-specific conferences like IMAPS (International Microelectronics and Packaging Society) and ASE (Automotive Society of Engineers) and is on the IPC (IPC - Association Connecting Electronics Industries) Specification Review Panel.
She has extensive experience with military and aerospace electronics and optical systems as well as satellites from smaller communication units to large optical benches. Additionally, she has R&D through production experience with automotive under-hood engine and transmission controllers. Her experience has included all levels of parts reliability for systems ranging from 6-month to 10-year reliabilities.
She has expertise in:
• Solidworks CAD and Solidworks Simulation (includes structural and thermal analysis)
• Development of board design specifications
• Prototype development to production
• Solder fatigue analysis — Englemaier and low-cycle thermal fatigue
• Reliability analysis parts and materials issues
• Packaging design including interfaces and circuit boards
• Harsh environment testing including accelerated life, thermal, vibration, thermal shock, mechanical shock, etc.