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TAS Consulting Information Card
2024
Brief biographical information and list of
technical services offered by TAS Consulting.
This is our TAS Consulting Services List.
File size: 255 Kb
Flexible Electronics - Packaging Design
May 2016
Keywords: Flexible printed circuits, FPC, flex circuit
construction, 3D mockups, surface mount components,
routing and bias, service loops, staggered lengths,
blind vias, stiffeners, and ground planes.
File size: 315 Kb
1.0 Flex Electronics - Packaging Design
March 31, 2016
Part 1 of 2
Keywords: Flexible printed circuits, FPC, flex circuit
construction, 3D mockups, surface mount components,
routing and bias, service loops, staggered lengths,
blind vias, stiffeners, and ground planes.
File size: 3.3 Mb
2.0 Flex Electronics - Layout and Heat Removal
March 31, 2016
Part 2 of 2
Keywords: Flexible printed circuits, FPC, flex circuit
construction, layout issues, specifications used, nomograph,
heat removal, testing, and analysis.
File size: 2.9 Mb
Solder Fatigue for Lead and Lead-Free Solders with Best Practices
May 2015
Keywords: RoHS affects solderability of parts, solder choices, thermal extremes, part failures, testing, and analysis.
File size: 180 Kb
Defense Electronic Trends
May 2014
Keywords: RoHS Restriction of Hazardous Materials, solder choices, SiC Silicon Carbide junction, counterfeit parts, special processors, and qualified parts.
File size: 168 Kb
Design for Manufacture Improvement
May 2013
Keywords: Solidworks Professional Simulation, mechanical aspects, thermal aspects, DFM, design for manufacturing, FEA, finite element analysis, molding tool, fatigue, material properties, board analysis, reliability.
File size: 283 Kb
Quality vs. Reliability
for Solder Joints, Why Test?
January 2012
Keywords: Screening procedures, design guidelines, surface mount electronic assemblies, Anatech, IPC SM-785, IPC-D-279, Quality, Reliability.
File size: 164 Kb
Anatech Usage Presentation
Dated: February 2012
Keywords: Event Detectors, electrical interconnects, design for test.
File size: 123 Kb
Improving System Reliability with Different Materials
May 8, 2012
IMAPS NE 39th Symposium & Expo, Boxborough, MA
Keywords: Ball Grid Arrays, Failure Mode Effects Analysis (FMEA), tin whiskers, thermal hot spots, encapsulants, adhesives.
File size: 336 Kb
Reliability Concerns: Pitfalls and Issues (How To Avoid Them)
May 22, 2012
Automotive IMAPS Conference,
Dearborn, MI
Keywords: Conformal coatings, underfills, thermal path solutions, board layout, tin whiskers.
File size: 332 Kb
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