Thermal Analysis Systems

Design Reliability for Less

  • Design and Analytical Services Provide

  • • Improved reliability

  • • Less returned product

  • • Improved thermal relief

  • • Remove solder fatigue issues


TAS Consulting Events Calendar

IMAPS New England Chapter, 43nd Symposium & Expo

"3D and Beyond"

Took place on May 3, 2016

Holiday Inn Conference Center
Boxborough, Massachusetts

TAS Consulting presented a paper "Flexible Electronics — Packaging Design"

Speaker: Tina Barcley

See more details about this event at: http://www.imapsne.org/SymposiumExpo.php

To review the presentation, click here.

IEEE Course

"Flexible Electronics — Packaging Design and Materials Analysis"

Took place on March 31, 2016

Crowne Plaza Hotel, 15 Middlesex Canal Park Road
Woburn, Massachusetts

TAS Consulting offered an IEEE class titled "Flexible Electronics — Packaging Design and Materials Analysis for Aerospace, Military, Medical & High End Consumer Products"

Instructor: Tina Barcley

To review the course outline, click here.

Link to current IEEE class offerings, click here.

IMAPS New England Chapter, 42nd Symposium & Expo

"3D Technology Trends & Key Manufacturing Challenges"

Took place on May 5, 2015

Holiday Inn Conference Center
Boxborough, Massachusetts

TAS Consulting presented a paper titled "Solder Fatigue for Lead and Lead-Free Solders with Best Practices."

Speaker: Tina Barcley

To review the presentation, click here.

IMAPS New England Chapter, 41st Symposium & Expo

"Explore the Next Generation of Microelectronics"

Took place on May 6, 2014

Holiday Inn Conference Center
Boxborough, Massachusetts

TAS Consulting presented a paper titled "Defense Electronics Trends Affecting High-end Electronics."

Speaker: Tina Barcley

To review the presentation, click here.

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